Polishing and cleaning of wafer edges.

The best quality along the edge zones of the silicon wafer.

The Decker single wafer spin etching system allows you to ensure the best possible wafer quality even along the edge zones.

System characteristics:

  • High-precision processing of edges by spray etching
  • Manually operated system, flexible regarding quality and dimensions
  • Specifically for thyristors of almost all sizes
  • Other single-wafer applications (pattern/trench etching) possible


  • Extremely low water and detergent consumption
  • Sustainably low operating costs
  • Integrates seamlessly into the production process
  • Individually tailored system design
  • Turnkey solution possible

Decker Anlagenbau GmbH
Wegscheid 1a
92334 Berching

Tel.: +49(0)84 62 2006 17-0
Fax: +49(0)84 62 2006 17-11

Montag bis Freitag

8:00 Uhr - 12:00 Uhr


12:45 Uhr bis 16:30 Uhr