Recycling silicon results in permanent cost reductions through use of nearly 100% of the produced Si material

When processing polycrystalline silicon or during wafer production, it is almost impossible to avoid breakage. DECKER’s innovative recycling unit ensures not a single gram of precious silicon is lost!

The granule etching unit chops down “old wafers” or wafer breakage down to a maximum size of 5 mm and cleans the surface using an acid etching process. The process is carried out using a throughfeed operation with unique vacuum technology. The minimum annual capacity of the unit is 60 kg/h x 6,600 h = 386 t p.a.

System characteristics:

• Fully automatic chopping, etching, drying, portioning and bagging
• Systematic extraction of harmful gases with subsequent purification
• Bagging under clean room conditions
• Recycling of up to 1,000 tons of granule per year
• Extremely low consumption of chemicals and rinse water
• Important process parameters are continually monitored

Advantages:

• Have a cost-reducing effect in the long term
• Particularly resource-saving
• Reliable system design
• Re-creates superlative high-quality silicon
• Innovative drying concept
• Individually adapted
• Turnkey solution possible